Jerome,
I was unaware of Pb ever being in electroless nickel plating, nor do I
recall seeing it in any SEM or Auger spectroscopy. Is it there
"generally" throughout the PCB industry, and thus a concern to me, or is
Pb only added in "special" applications where the end user would need to
request it and thus be "aware" of the content?
Regards,
Ryan Grant
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Jerome Wagner
Sent: Wednesday, December 08, 2004 2:03 PM
To: [log in to unmask]
Subject: [LF] ECP: [LF] Lead in ENIG plating
Steve: We are aware of Pb contents up to, let's say, 700 ppmw in
electroless Ni deposits... I am told that it functions in the deposit as
a
grain refiner; in that sense, it is there intentionally.
For the present, I am considering this content to be RoHS-compliant,
based
on the following rationale: 700 ppmw is less than the proposed MCV of
1,000
ppmw; proposed MCV definition makes no mention of "intentional". I
further
rationalize that the "intentional" concept was negotiated away by
forcing
the "homogeneous material" definition to the lowest level - i.e., the Ni
deposit itself - such that averaging over other materials in the
assembly
would not be allowed in order to make the content "allowable". I am
aware
of academic arguments which would have any intentional content
prohibitted...
Certainly interested in validation of this understanding, as it is
pivotal
to me!
jw
!! God Blesses !!
Jerry Wagner Dept 0056 Environmental Engineering B096-1
x56275 pg 58888-0658 (607)755-6275 fax: (607)755-6282
Huron Real Estate Associates, LLC and Endicott Interconnect
Technologies,
Inc.
Via the Internet: [log in to unmask] [NOTES: Jerome
Wagner/Huron/EIT]
Steve Bezuk
<steve.bezuk@KYOC To:
[log in to unmask]
ERA.COM> cc:
Sent by: Leadfree Subject: [LF] Lead in
ENIG plating
<[log in to unmask]
>
12/08/2004 01:00
PM
Please respond to
"(Leadfree
Electronics
Assembly Forum)";
Please respond to
Steve Bezuk
Forgive me if this has already been addressed. I have a question on the
interpretation of the lead that is found in ENIG platings. Lead
compounds
are commonly used as a stabilizer for the Ni in e-less Ni plating
solutions. It is also commonly found in the Pd activator solutions. The
then becomes buried in the plating even though it is not wanted or need
in
the final plating. I have not seen this issue discussed except by the
plating solutions companies that are working on solutions. The question
is
whether or not this lead is considered intentionally or unintentionally
added. I have heard both interpretations. I am also interested in
comments
on this issue. Some materials proposed to replace the Lead although not
on
the RoHS list are more toxic than the Lead and present in higher
concentrations, Thallium for instance.
Steve Bezuk, PhD
GM Market Development
Kyocera America Inc
------------------------------------------------------------------------
-------Leadfee
Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks
send:
SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask]
or
847-615-7100 ext.2815
------------------------------------------------------------------------
-------
------------------------------------------------------------------------
-------Leadfee Mail List provided as a service by IPC using LISTSERV
1.8d
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks
send: SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
------------------------------------------------------------------------
-------
-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-------------------------------------------------------------------------------
|
