Steve: We are aware of Pb contents up to, let's say, 700 ppmw in
electroless Ni deposits... I am told that it functions in the deposit as a
grain refiner; in that sense, it is there intentionally.

For the present, I am considering this content to be RoHS-compliant, based
on the following rationale: 700 ppmw is less than the proposed MCV of 1,000
ppmw; proposed MCV definition makes no mention of "intentional". I further
rationalize that the "intentional" concept was negotiated away by forcing
the "homogeneous material" definition to the lowest level - i.e., the Ni
deposit itself - such that averaging over other materials in the assembly
would not be allowed in order to make the content "allowable". I am aware
of academic arguments which would have any intentional content
prohibitted...

Certainly interested in validation of this understanding, as it is pivotal
to me!

jw


!! God Blesses !!

Jerry Wagner  Dept 0056  Environmental Engineering  B096-1
x56275  pg 58888-0658   (607)755-6275   fax: (607)755-6282
Huron Real Estate Associates, LLC  and  Endicott Interconnect Technologies,
Inc.
Via the Internet: [log in to unmask]  [NOTES: Jerome Wagner/Huron/EIT]




                      Steve Bezuk
                      <steve.bezuk@KYOC        To:       [log in to unmask]
                      ERA.COM>                 cc:
                      Sent by: Leadfree        Subject:  [LF] Lead in ENIG plating
                      <[log in to unmask]
                      >


                      12/08/2004 01:00
                      PM
                      Please respond to
                      "(Leadfree
                      Electronics
                      Assembly Forum)";
                      Please respond to
                      Steve Bezuk






Forgive me if this has already been addressed. I have a question on the
interpretation of the lead that is found in ENIG platings. Lead compounds
are commonly used as a stabilizer for the Ni in e-less Ni plating
solutions. It is also commonly found in the Pd activator solutions. The
then becomes buried in the plating even though it is not wanted or need in
the final plating. I have not seen this issue discussed except by the
plating solutions companies that are working on solutions. The question is
whether or not this lead is considered intentionally or unintentionally
added. I have heard both interpretations. I am also interested in comments
on this issue. Some materials proposed to replace the Lead although not on
the RoHS list are more toxic than the Lead and present in higher
concentrations, Thallium for instance.

Steve Bezuk, PhD
GM Market Development
Kyocera America Inc

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