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| Reply To: | (Leadfree Electronics Assembly Forum) |
| Date: | Wed, 8 Dec 2004 08:26:29 -0700 |
| Content-Type: | text/plain |
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My expectation would be to find out if there was a distinct line between the balls and the surface of the board (non or minimal melding), or if any fractures are apparant. This would give me an idea of reliability
Carol
-----Original Message-----
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: December 07, 2004 7:04 PM
To: [log in to unmask]
Subject: Re: [LF] Transition questions, Pb to Pbfree wave soldering ??
Hi Carol,
How on Earth do you "determine long term reliability...[from] samples [sent]
to a lab for xray and cross sectioning and comparison evaluations ?" That
would be a pretty neat triock; unfortunately none of the test indicated will tell
you anything about long-term reliability.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com
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