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December 2004

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Subject:
FW: Bypass caps under BGAs using via in pad
From:
Gary Boccoleri <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Wed, 8 Dec 2004 17:04:05 -0800
Content-Type:
text/plain
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text/plain (32 lines) 
pad

Hi All,

I'm looking at a spec for a new processor we may be using. They
recommend using via in pad and show a diagram of how to place 0402
bypass caps right on the vias under the chip. Has anybody done this?
This brings up a few questions. Since 2 adjacent vias will form the
footprint for the caps, should I make the bottom pad of the via a square
that approximates the pads I normally use on these caps? How do I place
the caps without creating DRCs? Will our assembly house be completely
dumbfounded when they see this? Is this whole idea just a figment of
some engineers imagination with no basis in reality?

Thanks for all help 

Gary Boccoleri
Bivio Networks
925-924-8621
www.bivio.net
 


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