Subject: | |
From: | |
Reply To: | |
Date: | Thu, 2 Dec 2004 12:53:51 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Bill
I would look at these, but there are others which have the constancy of ink such as used in Hybrids that should do as well and will be far less trouble to apply. To a large extent the application will probably dictate the material.
Best regards
Lee
----- Original Message -----
From: Brooks,Bill<mailto:[log in to unmask]>
To: [log in to unmask]<mailto:[log in to unmask]>
Sent: Thursday, December 02, 2004 12:49 PM
Subject: Re: [TN] Plating through a 2 layer board hole after assembly?
Oh I think I see, much like the sliver loaded epoxy materials they use to
plug vias?
Bill Brooks - KG6VVP
PCB Design Engineer , C.I.D.+, C.I.I.
Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
e-mail:[log in to unmask]
http://www.dtwc.com<http://www.dtwc.com/>
http://pcbwizards.com<http://pcbwizards.com/>
-----Original Message-----
From: Dennis Fritz [mailto:[log in to unmask]]
Sent: Thursday, December 02, 2004 5:50 AM
To: [log in to unmask]<mailto:[log in to unmask]>
Subject: Re: [TN] Plating through a 2 layer board hole after assembly?
In a message dated 12/1/04 4:36:36 PM Central Standard Time,
[log in to unmask]<mailto:[log in to unmask]>
writes:
<< Selective electroless plating would be the ideal option but I don't think
anyone has invented it yet... >>
Electroless plating involves a sequence of at least five successive chemical
immersion steps. The amount of masking of the rest of the board would make
this impractical. Conductive ink is a distinct possiblity as a large number
of
"inexpensive" double sided boards are produced in the Far East with "Silver
Through Hole" paste in all the vias.
Denny Fritz
MacDermid, Inc.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask]<mailto:[log in to unmask]> with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]<mailto:[log in to unmask]>: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]<mailto:[log in to unmask]>: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives<http://listserv.ipc.org/archives>
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16<http://www.ipc.org/contentpage.asp?Pageid=4.3.16>
for additional information, or contact Keach Sasamori at [log in to unmask]<mailto:[log in to unmask]> or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask]<mailto:[log in to unmask]> with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]<mailto:[log in to unmask]>: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]<mailto:[log in to unmask]>: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives<http://listserv.ipc.org/archives>
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16<http://www.ipc.org/contentpage.asp?Pageid=4.3.16> for additional information, or contact Keach Sasamori at [log in to unmask]<mailto:[log in to unmask]> or 847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|