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December 2004

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Thu, 23 Dec 2004 13:09:44 -0500
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The current ENIG standard is IPC-4552.  The spec on thickness for all
classes is 2 uinch minimum for gold and 118-236 for nickel. 

Jeffrey Bush
Director, Quality Assurance and Technical Support

VERMONT CIRCUITS INCORPORATED
  76 Technology Drive - POB 1890
    Brattleboro, Vermont 05302
      Voice: 802.257.4571.21 Fax: 802.257.0011
           http://www.vtcircuits.com
 

-----Original Message-----
From: David Harman [mailto:[log in to unmask]] 
Sent: Thursday, December 23, 2004 1:01 PM
To: [log in to unmask]
Subject: [TN] Immersion gold specification

Hope the network out here has a great holiday and successful new year.
 
 
I have one last question for this year regarding plating standards and
specifications.  
 
 
I am trying to call out gold immersion specification over nickel on my
PCBA.   My understanding is Mil-G-45204 type ll is no longer a valid
specification. 
 
Is the industry standard  3 micro inches max - 1 micro inch min.  (As
long as the process can be controlled you should not have any nickel
migration.)  Is this correct.
 
 
 
Can some one tell me how I would spec this out on my drawing and what
standard is used in the industry for gold immersion over a an absolute
minimum of .00005 nickel.
 
 
 
 
 
Thanks

David Harman

 

 

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