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Date: | Thu, 23 Dec 2004 13:09:44 -0500 |
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The current ENIG standard is IPC-4552. The spec on thickness for all
classes is 2 uinch minimum for gold and 118-236 for nickel.
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice: 802.257.4571.21 Fax: 802.257.0011
http://www.vtcircuits.com
-----Original Message-----
From: David Harman [mailto:[log in to unmask]]
Sent: Thursday, December 23, 2004 1:01 PM
To: [log in to unmask]
Subject: [TN] Immersion gold specification
Hope the network out here has a great holiday and successful new year.
I have one last question for this year regarding plating standards and
specifications.
I am trying to call out gold immersion specification over nickel on my
PCBA. My understanding is Mil-G-45204 type ll is no longer a valid
specification.
Is the industry standard 3 micro inches max - 1 micro inch min. (As
long as the process can be controlled you should not have any nickel
migration.) Is this correct.
Can some one tell me how I would spec this out on my drawing and what
standard is used in the industry for gold immersion over a an absolute
minimum of .00005 nickel.
Thanks
David Harman
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Technet Mail List provided as a service by IPC using LISTSERV 1.8e
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Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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