Hi Jack,
It is not quite that simple--your method only works if you have a good
distribution throughout the solder volume. Often, because of short and low peak
reflow temperatures, the Au stays concentrated near its original location; thus
less Au still will give you trouble. But as you pointed out, with IAu you are
safe, regardless.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com


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