Hello, we have recently started to get many boards that we do Gold plated (I do not know the spec).

Our wave solder guy is having some problems with it not being as good as tin to flow solder. 
As an example he showed me how with an empty tinned pad, solder will flow up through a PTH hole & make a dome on the component side, if it is Gold plated, the solder will only wick 1/2 way up the hole.

Is there a change to the process needed to solder Gold plated pads?

Our flux is identified on the barrel as "no clean 3590T".

Also, is there any reason why the board manufacturers would need to increase small PTH pad sizes to be able to gold plate the pads?
We have a PTH hole for a 1UF cap, that has a .7mm hole in a .04" wide pad (nice mix of units!) where normally there is very little pad edge after the hole, but it is a long pad. A recent batch has come in with the pad widths being much wider & are causing shorts.

Thankyou, Matthew Lamkin.

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