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November 2004

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Subject:
From:
Dave Sorg <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dave Sorg <[log in to unmask]>
Date:
Thu, 4 Nov 2004 16:22:22 -0600
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I'm trying to learn more about and evaluate the fluxes we use in our no-
clean hand soldering processes in a contract manufacturing environment. In
the IPC-HDBK-001 "Handbook and Guide to Supplement J-STD-001", table 4-13B
includes "recommendations" for class 2 product that basically says to use
only an L0, L1 or M0 rated flux for RO and RE type fluxes if the residues
are to be left on the board. However, I'm told one of the tried and true
flux cores for 63/37 wire is the Kester #44, which has a ROM1 flux
designator. On top of that, I'm told that when supplemental flux is needed,
an ROM1 liquid flux is often used, again without removing the residues.

Should we really be backing away from the ROM1 fluxes for no-clean/don't
clean hand soldering processes? I'm going to have a hard time selling that
when the Kester #44 is a long time industry standard. Won't a lower
activity flux be problematic for the more difficult finshes like palladium,
immersion tin and immersion silver?

Thanks for your comments

Dave Sorg
Manufacturing Engineer
Servatron
509-891-3137
[log in to unmask]

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