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November 2004

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Subject:
From:
Yannick Brisson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Yannick Brisson <[log in to unmask]>
Date:
Thu, 4 Nov 2004 15:05:14 -0500
Content-Type:
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text/plain (23 lines)
Hi everyones,

        I would like to have your input and idea on it.  we have a board
with 1 D-Pack SMT on it. For the heat sink there are some hole on the board
under the component body.  So after the oven the paste have sunk on the
other side of the board.  We don't want any solder on the other side .  We
didn't desing the board so we couldn't change it.  Do you know some trick to
block the paste from going on the back side of the board?

Thank You

Yannick

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