Customer states 100 micro inches and the purpose of the NI is due to heat
from the flip chip package.

James Hofer
Director of Operations
Accurate Circuit Engineering
3019 S. Kilson Dr.
Santa Ana Ca. 92707-4202
714-546-2162 work
714-473-6127 cell
[log in to unmask]
----- Original Message -----
From: "Wenger, George M." <[log in to unmask]>
To: "James Hofer" <[log in to unmask]>; <[log in to unmask]>
Sent: Thursday, November 04, 2004 11:33 AM
Subject: RE: [TN] Immersion Silver


James,

Is your customer asking for 100 microns or 100 microinches?  Does you
customer want this surface finish for soldering or for wirebonding?

Regards,
George

George M. Wenger (908)-546-4531
Reliability / FMA Engineer
Base Station and Subsystems Group
Andrew Corporation,  40 Technology Drive, Warren, NJ 07059
[log in to unmask]



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of James Hofer
Sent: Thursday, November 04, 2004 1:41 PM
To: [log in to unmask]
Subject: [TN] Immersion Silver


I have a customer asking for Imm Silver over 100um NI. I am concerned
putting the Silver over the NI as it may lift or peel. This is the first
time I have had this kind of request. Have any of you well informed Tech
Heads heard of this before???
ps. This customer also asked for OSP over the Silver over the NI. I KNOW
that is not done.

Thanks for any feedback,

James Hofer

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