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November 2004

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Subject:
From:
Daan Terstegge <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Daan Terstegge <[log in to unmask]>
Date:
Mon, 1 Nov 2004 09:19:45 +0100
Content-Type:
text/plain
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text/plain (77 lines)
Hi Bob,

Good attitude!!
My suggestion is that you have a visit to my webpages on
http://www.smtinfo.net and click on the link to "DFM". From there you
can view and download several DFM guides, with all the design rules to
ease the manufacturing process.




Best regards,

Daan Terstegge
PCB Assembly Department
Thales Land & Joint Systems

Tel        +31(0)35 524 8297
Fax       +31(0)35 524 8181
[log in to unmask]
Unclassified Email

>>> [log in to unmask] 10/30/04 08:03pm >>>
Hi All,

I'm a board designer and I'm looking for as much info
as I can find about the
differences/methods/similarities to IR reflow,
wave-solder, convection et al.

What can I do at the design stage to make things
easier?

Is the method used figured out AFTER the board gets to
you for assembly?

What board finishes give the least headaches?

I'm thinking of component orientation and I'd be glad
to listen to anything that I could do to smooth things
out.

(I never did like the chuck it over the wall method of
sending a board to fab and assembly).

Regards,

Bob Wilson
www.cstone-design.com

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