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November 2004

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Subject:
From:
David Douthit <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, David Douthit <[log in to unmask]>
Date:
Tue, 30 Nov 2004 20:21:16 -0700
Content-Type:
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text/plain (73 lines)
Bill,

Could conformal coating stop the whiskers from forming
after assembly?
No, but it can slow it down some.

David A. Douthit
Manager
LoCan LLC



Brooks,Bill wrote:

>I showed the tin whisker nightmare photo's to an RF engineer I know here and
>she said that they had similar problems years ago in the Space applications
>field and the solved it by coating the surface with 'Q-Dope' a
>polystyrene/tolulene
>
>Q-Dope
>http://www.takefiveaudio.com/gc_q_dope.htm
>
>Material/Safety specs
>http://www.chess.cornell.edu/Safety/MSDS/polystyrene_Q_Dope.htm
>
>TIN Whisker Pictures
>
>http://nepp.nasa.gov/whisker/photos/waveguide/index.html
>
>
>Maybe the solution to TIN plating issues is some sort of coating or barrier
>to prevent whiskers? Could conformal coating stop the whiskers from forming
>after assembly?
>
>(Makes you wonder why we are even caving in to the pressure to change from
>tin/lead solder....)
>
>
>
>Bill Brooks - KG6VVP
>PCB Design Engineer , C.I.D.+, C.I.I.
>Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
>e-mail:[log in to unmask]
>http://www.dtwc.com
>http://pcbwizards.com
>
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