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November 2004

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Subject:
From:
"Brooks,Bill" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brooks,Bill
Date:
Tue, 30 Nov 2004 16:07:46 -0800
Content-Type:
text/plain
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text/plain (73 lines)
Don't laugh... I have been asked to find out if we can plate thru a 2 layer
board hole top to bottom after the board has been assembled... Is this
possible? If so how? And who would do it?
Other alternatives to get connectivity from the top to the bottom side of an
already assembled board?
Z-wires? Eyelets? Any other ideas?

The non-plated hole is .156 diameter and the thickness of the board is .063
FR4 glass/epoxy material 2oz copper both sides.


Thanks in advance..


Bill Brooks - KG6VVP
PCB Design Engineer , C.I.D.+, C.I.I.
Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
e-mail:[log in to unmask]
http://www.dtwc.com
http://pcbwizards.com


-----Original Message-----
From: R Sedlak [mailto:[log in to unmask]]
Sent: Tuesday, November 30, 2004 3:31 PM
To: [log in to unmask]
Subject: Re: [TN] Immersion White Tin Plating Specification

Before we go off writing specifcations that make the fabrications people
spit and swear, I want to remind all that all immersion plating is
self-limiting, and when all the substrate is covered, you stop plating, no
matter what temperature, or how long you leave it in the plating bath...

Most fabricators have trouble getting 50 microinches of Tin, and 40 is
pretty much the standard...

30 is pretty considered pretty thin..
And, no flat finishes are going to perform as well as HASL, if only because
of thickness, nevermind superiority of alloy...

Rudy Sedlak
RD Chemical Company



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