Have some quick screen experience. They hold up rather well and may
actually have some applicability on the lower end (peak < 255 degC)of
the Pb-free process spectrum. Issue is that they seem to be rather
challenged if you try to use a boards coated for a Pb-free process in a
Sn/Pb process.  Can't seem to burn off the coating. Just too robust.

BTW - Rumor has it that these newer OSP coatings for Pb-free seem to
based on Aryl-Phenyl Imidazole compounds. 

Rich K / KEDS


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Cheryl Tulkoff
Sent: Tuesday, November 30, 2004 8:59 AM
To: [log in to unmask]
Subject: [TN] Entek Plus Cu106A HT


Has anyone replaced their old OSP with the Entek Plus Cu106A HT (high
temperature)on standard tin/lead processes? We don't have lead-free
processes yet but our board vendors would like us to use this material
now as they convert. It is supposed to provide significantly improved
performance for lead-free. It is not supposed to impact solderability
for eutectic tin/lead soldering processes. We will be evaluating some
samples but are looking for someone who might have tried this in their
processes.

Thanks, Cheryl

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