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November 2004

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Subject:
From:
Eddie Rocha <[log in to unmask]>
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Date:
Wed, 24 Nov 2004 13:59:13 -0800
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High Td FR4 is what you'll want for the lead-free assembly process.
That's the decomposition temperature (Td). It is available now and it
processes the same as 170 Tg FR4.

On 24 Nov 2004 at 15:08, Black, Paul wrote:

Hi Tech Gurus,

As people talk more and more about Lead free, I keep hearing that
standard FR boards might not be able to take the extra heat
required for a reliable Lead free solder joint. The problem is that I
keep hearing the word MIGHT. I have not heard that this is definitely
true and, if it is true, I have not heard anyone offer a cost effective
solution. So, I am asking the many experts on this forum, will
standard FR4 be able to handle the higher excursions (particularly,
let's say, for a 7" X 9",  8 layer, double-sided SMT, .062" 5/5 board)
associated with Lead free solder paste? If not, what would be the
most cost-effective offering (i.e. high Tg FR4)?

Thank you,
Paul Black
Manufacturing Engineer
Kronos

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-- Thanks,
Eddie Rocha
South Bay Circuits
(480) 940-3125 x122

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