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November 2004

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Subject:
From:
John Parsons <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, John Parsons <[log in to unmask]>
Date:
Wed, 24 Nov 2004 12:05:28 -0800
Content-Type:
text/plain
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text/plain (85 lines)
Dear Group,

With regards to the warping issues inherent with this design, do you think
that some gains could be made by increasing the core thickness for layers
5/6 thereby reducing the preg thickness between 3 and 4?  We don't play
around much with unbalanced builds so I have no practical experience to fall
back on at this moment in time.

Thanks
John Parsons

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of John Parsons
> Sent: November 24, 2004 11:11 AM
> To: [log in to unmask]
> Subject: Re: [TN] Controlled Impedance Design
>
>
> Hmmm, tricked again!  So much for trying to get all my ducks in a
> row before
> contacting the customer.  His reply to my questions relating to his
> impedance controls design was this;
> "The board is not really an controlled impedance design. It is an IS
> (Intrinsic Safety) design. We require the 1mm clearance from the copper on
> layer 4 to the copper on the bottom layer."
>
> Thanks for all your input.
>
> Now, how to make this puppy FLAT?
>
> John
>
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]]On Behalf Of John Parsons
> > Sent: November 24, 2004 9:19 AM
> > To: [log in to unmask]
> > Subject: [TN] Controlled Impedance Design
> >
> >
> > This is one for the experts.  I have been under the general
> > assumption that
> > with controlled impedance designs (single ended microstrip) that the
> > reference plane is typically the first adjacent plane layer
> encountered in
> > the stack-up.  We are quoting a 6 layer build for a customer
> which has the
> > following stack-up (cap construction specified)
> > L1 Signal Layer (2oz)
> > 8mil core
> > L2 Split Plane Layer (2oz)
> > 5mil preg
> > L3 Split Plane Layer (2oz)
> > 5mil core
> > L4 Split Plane Layer (2oz)
> > 22mil preg
> > L5 Split Plane Layer (2oz)
> > 22mil core
> > L6 Signal Layer (2oz)
> > We have not built this before but they have indicated that previous
> > prototypes suffered from warping (you don't say!) and the doc's
> > state "This
> > is a controlled impedance PCB.  Spacing between L4 and L6 must be 44mil.
> >
> > My question, from a controlled impedance perspective does it
> seem to make
> > sense to spec the distance between the outer layer 6 and layer
> 4 (2 plane
> > layers away) as having a critical spacing requirement?  We have not been
> > provided with the impedance requirement nor the critical traces.
> >
> > Educate me please!
> >
> > Regards
> > John Parsons

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