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November 2004

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Subject:
From:
Roger Stoops <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Roger Stoops <[log in to unmask]>
Date:
Wed, 24 Nov 2004 12:08:48 -0500
Content-Type:
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text/plain (453 lines)
Actually, sounds like ol' Karl may have been thinking of the Scripture that basically says (depending on xlation) 'The spirit is willing, but the flesh is weak' (Jesus, Nisan 14, 33 C.E., Mk 14:38).  But since he also wrote that 'religion is the opium of the people' (something to that effect), he would have had to change "spirit" to "mind" for his philosophy to carry the meaning he intended.

Just thinking out loud.  Sorry if anyone takes offense at the volume.

Roger

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Gebhard.Neifer
Sent: Wednesday, November 24, 2004 11:50 AM
To: [log in to unmask]
Subject: [TN] AW: [TN] AW: [TN] Video analysis of solder joint formation
- NTC


Hats off to you, Ofer!







-----Ursprüngliche Nachricht-----
Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Ofer Cohen
Gesendet: Mittwoch, 24. November 2004 17:38
An: [log in to unmask]
Betreff: Re: [TN] AW: [TN] Video analysis of solder joint formation - NTC

Well, Gerhard, it was indeed written in German, by Karl Marks, in the Communist Manifest.





This statement is a well known example of the limitation of the machines: When the first interpreting machines were developed, this statement was translated into Russian, re-translated into English, and the result was "The Vodka is good, but the meat is rotten".




Ofer




-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gebhard.Neifer
Sent: Wednesday, November 24, 2004 18:07
To: [log in to unmask]
Subject: [TN] AW: [TN] Video analysis of solder joint formation




Bob,




in german we have a spoken word which goes like "My mind is willing, only the flesh is weak ..."




Don´t copy David´s penalty performance!




Gebhard




_______________________________

Delphi Deutschland GmbH

Body & Security Electronics

Manufacturing Engineering Design

Albert Einstein Straße 5




D-51674 Wiehl-Bomig




Tel.:         +49 (0)2261-971-880

Fax:         +49 (0)2261-972-880

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E-mail: [log in to unmask]        




















-----Ursprüngliche Nachricht-----

Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Bob willis

Gesendet: Mittwoch, 24. November 2004 17:00

An: [log in to unmask]

Betreff: Re: [TN] Video analysis of solder joint formation




Yes you are right; I was trying to be helpful so the forum could look at

this area only. As I run the site I should know this.




I will sort out links separately TOMMOROW; I have to go to soccer practice

now. After watching the David BeckHam DVD I have these new skills to tryout.

Well the mind knows what to do it's the legs I have TO SORT OUT.







Bob Willis

2 Fourth Ave, Chelmsford,

Essex, CM1 4HA, England

Tel: 01245 351502

Fax: 01245 496123

Mobile: 07860 775858

Email: [log in to unmask]

Web: www.leadfreesoldering.com

Web: www.bobwillis.co.uk










-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Pasquito, Helena

Sent: 24 November 2004 15:34

To: [log in to unmask]

Subject: Re: [TN] Video analysis of solder joint formation




Bob,

I am not able to access the site without a password.




Helena Pasquito




-----Original Message-----

From: TechNet [mailto:[log in to unmask]]On Behalf Of Bob willis

Sent: Wednesday, November 24, 2004 9:12 AM

To: [log in to unmask]

Subject: [TN] Video analysis of solder joint formation







Following a number of emails from TECHNET on video simulations, just though

I would show a few we have featured on the SMART Group web site over the

last few years.




Thanks to Dave Hillman and Doug Pauls for letting me know of the interest at

the SMART Group Conference last week.




RealPlayer is available to download free from a variety of location.




QFP Cracking/Popcorning  BGA Popcorning  PCB Delamination  BGA Solder Short

Inspection

Immersion Testing Components (the Components where in my jacket honest)

Lead-Free Chip Tombstone

Outgassing from Via Holes

Solder Balling During Wave Soldering

Solder Beading During Reflow

Slow Wetting on Surface Mount Pads

Poor Component Solderability

Solder Balling of Solder Paste

Copper Dendrite Growth on PCB

Component Loss on Double Sided Reflow

Outgassing from Solder Mask during Wave Contact

Component Floating on Paste

0201 Chip Component Lifting

Outgassing During Soldering of PTH

Secondary Reflow of Lead-Free Joints




http://www.smartgroup.org/members/defectvid.asp







Have a great thanks giving break over there







Bob Willis




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