Bob,
in german we have a spoken word which goes like "My mind is willing, only the flesh is weak ..."
Don´t copy David´s penalty performance!
Gebhard
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Body & Security Electronics
Manufacturing Engineering Design
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-----Ursprüngliche Nachricht-----
Von: TechNet [mailto:[log in to unmask]] Im Auftrag von Bob willis
Gesendet: Mittwoch, 24. November 2004 17:00
An: [log in to unmask]
Betreff: Re: [TN] Video analysis of solder joint formation
Yes you are right; I was trying to be helpful so the forum could look at
this area only. As I run the site I should know this.
I will sort out links separately TOMMOROW; I have to go to soccer practice
now. After watching the David BeckHam DVD I have these new skills to tryout.
Well the mind knows what to do it's the legs I have TO SORT OUT.
Bob Willis
2 Fourth Ave, Chelmsford,
Essex, CM1 4HA, England
Tel: 01245 351502
Fax: 01245 496123
Mobile: 07860 775858
Email: [log in to unmask]
Web: www.leadfreesoldering.com
Web: www.bobwillis.co.uk
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Pasquito, Helena
Sent: 24 November 2004 15:34
To: [log in to unmask]
Subject: Re: [TN] Video analysis of solder joint formation
Bob,
I am not able to access the site without a password.
Helena Pasquito
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Bob willis
Sent: Wednesday, November 24, 2004 9:12 AM
To: [log in to unmask]
Subject: [TN] Video analysis of solder joint formation
Following a number of emails from TECHNET on video simulations, just though
I would show a few we have featured on the SMART Group web site over the
last few years.
Thanks to Dave Hillman and Doug Pauls for letting me know of the interest at
the SMART Group Conference last week.
RealPlayer is available to download free from a variety of location.
QFP Cracking/Popcorning BGA Popcorning PCB Delamination BGA Solder Short
Inspection
Immersion Testing Components (the Components where in my jacket honest)
Lead-Free Chip Tombstone
Outgassing from Via Holes
Solder Balling During Wave Soldering
Solder Beading During Reflow
Slow Wetting on Surface Mount Pads
Poor Component Solderability
Solder Balling of Solder Paste
Copper Dendrite Growth on PCB
Component Loss on Double Sided Reflow
Outgassing from Solder Mask during Wave Contact
Component Floating on Paste
0201 Chip Component Lifting
Outgassing During Soldering of PTH
Secondary Reflow of Lead-Free Joints
http://www.smartgroup.org/members/defectvid.asp
Have a great thanks giving break over there
Bob Willis
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