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November 2004

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Subject:
From:
Guenter Grossmann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Guenter Grossmann <[log in to unmask]>
Date:
Wed, 24 Nov 2004 11:03:35 +0100
Content-Type:
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Yannic

The so called lead containing component platings contain 5%Pb. Its
really not a big deal, you may as well solder lead free components
(except BGAs). I believe your wetting problems are more on the side of
the solder parameters, the age of the components or the flux.

Best regards

Guenter

EMPA
Swiss Federal Laboratories  for Materials Testing and Research
Centre for Reliability
Guenter Grossmann,  Senior Engineer

8600 Duebendorf
Switzerland

Phone: xx41 1 823 4279
Fax :     xx41 1 823 4054
mail:     [log in to unmask]

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