Excessive baking either at elevated temperatures or for a lengthy period of time sometimes drives plastic additives like antistats, mold release compounds and surfactants for leveling to the surface of plastic components including solder masks. I suspected that these residues caused wetting problems with conformal coatings, causing the coatings to "pull back" from the parts involved when coated.
Detection of these oily residues is iffy. IPC recommends a test with solvent extraction and weighing. The amount of residue is very small and near impossible to weigh.
Edward Mines BEChE, MEChE
238 Willard Dr.
Hewlett, NY 11557
516 205-6523
__________________________________________________
Do You Yahoo!?
Tired of spam? Yahoo! Mail has the best spam protection around
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
http://mail.yahoo.com