Leo (msg below) is chair of the IPC Soldering Technology Subcommittee
and as such is very actively involved with development of Revision D to
both J-STD-001 and IPC-A-610.
While the changes in designation of Process Indicator's haven't been
"sweeping" there are less than in the past. When working to resolve
comments about acceptability of a condition, leo helped steer the
discussion to includedthe question "can the process be changed to reduce
occurrence." If the answer was no, then the criteria was most likely
resolved to either "Acceptable" or "Defect".
Process indicators, when tracked, can reduce end costs by reducing scrap
or rework operations.
Jack Crawford, IOM
IPC Director Certification and Assembly Technology
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leo Lambert
Sent: Tuesday, November 02, 2004 10:18 AM
To: [log in to unmask]
Subject: Re: [TN] Process Indicators...
Process Indicators, Oh yes what a dilemma. My suggestions are one, take
a stand, NO TOUCH UP OF PROCESS INDICATORS and two take the soldering
irons away from the people doing the touch up.
This has been a problem for over 40 years and we're still talking about
it, can you believe it?
Any additional heat applied to the board creates cumulative damage to
the laminate, we know that, we've experienced that, and we've trained to
that.
What part of NO touchup don't they understand.
Hope this helps. I know it gets me hot under the collar when I hear
things like this and the inspectors are driving the quality, come on
engineering do your jobs.
Regards and thanks for allowing me to let off some steam.
Leo Lambert
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Charles Caswell
Sent: Tuesday, November 02, 2004 9:06 AM
To: [log in to unmask]
Subject: Re: [TN] Process Indicators...
Join the fight. I have been arguing this point for years. Just as bad
are rejections for class 3 defects on class 2 product. Better than 90%
of our class 2 will meet class 3
-----Original Message-----
From: Daan Terstegge [mailto:[log in to unmask]]
Sent: Tuesday, November 02, 2004 2:35 AM
To: [log in to unmask]
Subject: Re: [TN] Process Indicators...
Hi Steve,
I agree with you 100%
The description of process indicators, as written in the IPC-A610, says
it all. No discussion possible.
(hhmm, then why am I having so much discussion with our inspectors?
hhmm.,...??)
Best regards,
Daan Terstegge
PCB Assembly Department
Thales Land & Joint Systems
Tel +31(0)35 524 8297
Fax +31(0)35 524 8181
[log in to unmask]
Unclassified Email
>>> [log in to unmask] 11/02/04 02:01am >>>
Hi All!!
I've been getting into a number of debates about "Process Indicators"
as
described in the IPC-610...mostly with our inspectors. I know their
hearts are in the right place, but it seems that many times they will
reject the assemblies with "Process Indicators" back to our operators to
touch them up, so that they look more like the "Target Condition", to
be more cosmetically pleasing.
I've tried to explain things as best I can, but find that sometimes our
operators are touching up way more solder joints than they need
too...they're being "trained", as it were, by our inspectors. The
operators know that if something isn't "pretty" enough, it's going to
come back to them...so they're putting more labor into product than they
should.
I'm trying to find some way, any way, to be able to show our inspectors
that to touch-up something because it doesn't look like the target
condition, doesn't mean one is making things any better...I understand
that beauty is in the eye of beholder.
There was some talk in the past about the Intermetallic Layer being
thickened during subsequent reflow cycles, and causing fractures, but
Werner said that he's never seen a failure because of a thick
Intermetallic layer.
Process Indicators may happen as spelled out in the -610, sometimes not
only because of the assembly process, but because of the design, or
other factors.
I look at Process Indicators as a "Flag" to investigate whether or not
the issues can be addressed and resolved properly, if they can't be
resolved, then it's not a defect. Am I wrong about this?
As always, TIA!
-Steve Gregory-
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