Dee

The problem you are experiencing is not uncommon. I would suggest using
one of the epoxy via filling materials. There are several on the market
and the cost is acceptable.

Best regards

Lee

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dee Stover
Sent: Thursday, November 18, 2004 2:52 PM
To: [log in to unmask]
Subject: [TN] plugging vias

Hi all,

Besides the process of tenting vias what other options are available for
plugging vias on a board?  Solder? Epoxy?  ????  What sort of cost
differences are we talking about.

When using the tenting method have any of you experienced breakage in
the
mask barrier, during assembly or rework intervals?

We are experiencing is degradation of the vias that exist under quad
packages after rework.  Especially if quad packages are on both sides of
the board, directly over each other.  Remove one for rework the flux
goes
through the vias and takes up residence under the quad on the opposite
side
of the board.  Our dunk type ultrasonic cleaner doesn't seem to be able
to
wash the flux etc. out from under the quads.  We do not work with high
volume of anything so any equipment recommendations should be on the
moderate side.

Any experience on these matters you can pass along will be greatly
appreciated.



Dee Stover  [log in to unmask]
Sr. Tech Associate Elect
National Optical Astronomy Observatory
950 N Cherry Ave
Tucson, AZ 85719
www.noao.edu
520-318-8489
FAX 520-318-8303

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