I'm just now working with a missile unit that demands several hundred G's withstanding during some parts of a second. Nothing remarkable with that. Ordinary teflon boards, ordinary chips and small outline components, ordinary soldering of caps and other components. The rule is that all parts are steadily backed up or supported by heavy and strong metal constructions. And all parts are travelling steadily pressed against seat. Think of 'Space Mountain' in LA Disneyworld. The vechicle starts by means of some pressurized air unit, like sitting in a fully mounted Porsche. And all are sitting in the travel direction. At least when I visited it many hundred years ago. Or all these catapults all around the world, shooting youngsters right up in the air with hydraulics. None are hanging, all are pressed against seat. So, talking electronics, not so remarkable. Many ordinary chip components and small outline packagages withstand 10,000 G's ! Don't allow least unsupported part of the !
 board! And...no wet caps! And no free wires! Not a mm.

Advice: speak with the Myth Busters...

Ingemar Hernefjord
Ericsson Microwave Systems


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Steve Gregory
Sent: den 18 november 2004 21:37
To: [log in to unmask]
Subject: [TN] Assemblies built to withstand very high G-loads...


Afternoon All!

This is just a general question concerning assemblies that are built to withstand very, very high G-loads. G-loads that are much higher than airborn avionics, or even missiles. Is there any special processes that would need to be considered that would be radically different than what are used to build airborn avionics and/or missile electronics? If you can't talk about it I understand...

-Steve Gregory-

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