On Thu, 18 Nov 2004 12:52:06 -0700, Dee Stover <[log in to unmask]> wrote:

>Hi all,
>
>Besides the process of tenting vias what other options are available for
>plugging vias on a board?  Solder? Epoxy?  ????  What sort of cost
>differences are we talking about.
>
>When using the tenting method have any of you experienced breakage in the
>mask barrier, during assembly or rework intervals?
>
>We are experiencing is degradation of the vias that exist under quad
>packages after rework.  Especially if quad packages are on both sides of
>the board, directly over each other.  Remove one for rework the flux goes
>through the vias and takes up residence under the quad on the opposite side
>of the board.  Our dunk type ultrasonic cleaner doesn't seem to be able to
>wash the flux etc. out from under the quads.  We do not work with high
>volume of anything so any equipment recommendations should be on the
>moderate side.

In your particular case, it sounds as if a non-conductive epoxy fill would
be suitable for your needs. If you are only doing low-volume work, then
there is wouldn't be necessary to bring the via fill process in-house.
Instead, farm it out to a company that does via fill processing on a
sub-contract basis.

Stephen G. Pierce
SGP Ventures, Inc.

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