Steve,

We have a through hole system that is exposed to a rotational 18 G-load
as its operating environment.  On some larger components, we have used
RTV to bond them to the circuit boards.  For assemblies, we have used
more mounting screws than would have been used in a stationary unit.
Where this unit is spinning, it helped to mount the board upside down so
the components are "forced back into the boards".

Phil

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
Sent: Thursday, November 18, 2004 3:37 PM
To: [log in to unmask]
Subject: [TN] Assemblies built to withstand very high G-loads...

Afternoon All!

This is just a general question concerning assemblies that are built to
withstand very, very high G-loads. G-loads that are much higher than
airborn avionics, or even missiles. Is there any special processes that
would need to be considered that would be radically different than what
are used to build airborn avionics and/or missile electronics? If you
can't talk about it I understand...

-Steve Gregory-

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