Any one send this question to Ron Daniels or Jeff Ferry at Circuit
Technology Corp. I know they do monitor the Technet Forum. They teach
IPC A610 C training and also Solder Training.
SO, Ron and Jeff, what say ye ?? What about Bill Buckman. he is their
instructor. Very Knowledgeable individual.
Randy Bock Sr.
Quality Manager
Pitney Bowes
AddressRight Printers
(email) [log in to unmask]
Newtown Building 2
203 270-4931 Ext
8-426-4931 In
203 426-4982 Fax
Charles Caswell <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
11/02/2004 09:06 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Charles Caswell <[log in to unmask]>
To
[log in to unmask]
cc
Subject
Re: [TN] Process Indicators...
Join the fight. I have been arguing this point for years. Just as bad are
rejections for class 3 defects on class 2 product. Better than 90% of our
class 2 will meet class 3
-----Original Message-----
From: Daan Terstegge [mailto:[log in to unmask]]
Sent: Tuesday, November 02, 2004 2:35 AM
To: [log in to unmask]
Subject: Re: [TN] Process Indicators...
Hi Steve,
I agree with you 100%
The description of process indicators, as written in the IPC-A610, says
it all. No discussion possible.
(hhmm, then why am I having so much discussion with our inspectors?
hhmm.,...??)
Best regards,
Daan Terstegge
PCB Assembly Department
Thales Land & Joint Systems
Tel +31(0)35 524 8297
Fax +31(0)35 524 8181
[log in to unmask]
Unclassified Email
>>> [log in to unmask] 11/02/04 02:01am >>>
Hi All!!
I've been getting into a number of debates about "Process Indicators"
as
described in the IPC-610...mostly with our inspectors. I know their
hearts are
in the right place, but it seems that many times they will reject the
assemblies with "Process Indicators" back to our operators to touch
them up, so that
they look more like the "Target Condition", to be more cosmetically
pleasing.
I've tried to explain things as best I can, but find that sometimes
our
operators are touching up way more solder joints than they need
too...they're
being "trained", as it were, by our inspectors. The operators know that
if
something isn't "pretty" enough, it's going to come back to them...so
they're
putting more labor into product than they should.
I'm trying to find some way, any way, to be able to show our inspectors
that
to touch-up something because it doesn't look like the target
condition,
doesn't mean one is making things any better...I understand that beauty
is in
the eye of beholder.
There was some talk in the past about the Intermetallic Layer being
thickened during subsequent reflow cycles, and causing fractures, but
Werner said
that he's never seen a failure because of a thick Intermetallic
layer.
Process Indicators may happen as spelled out in the -610, sometimes not
only
because of the assembly process, but because of the design, or other
factors.
I look at Process Indicators as a "Flag" to investigate whether or not
the
issues can be addressed and resolved properly, if they can't be
resolved, then
it's not a defect. Am I wrong about this?
As always, TIA!
-Steve Gregory-
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