First of all, thanks to everyone for the excellent responses.  Thanks to
you guys, I have almost enough information to convince the design
engineers to change the drawing.  The only other information I need is
the spec(s) that board builders use to control the immersion silver
process.  Anyone out there have any that they can share?  I know that
IPC has IPC-4553 pending release, but are there any others out there?

Thanks!

Eric Kalgren
Manufacturing Engineer
Atlantic Microwave
Phone: 978-779-7062
Fax:     978-779-0101

-----Original Message-----
From: Werner Engelmaier [mailto:[log in to unmask]] 
Sent: Friday, November 12, 2004 3:28 PM
To: [log in to unmask]
Subject: Re: [TN] Electrodeposited Silver vs. Immersion Silver

Hi Eric,
You may not want that much Ag anyway--you've heard of
gold-embrittlement.
Well, silver-embrittlement is actually worse--so beware.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com


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