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November 2004

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Subject:
From:
"Brooks,Bill" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brooks,Bill
Date:
Tue, 16 Nov 2004 09:49:37 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (111 lines)
Recommended pattern from Protek looks much better than the one from IRC...
Take a look at the picture I posted on my FAQ page - I copied your original
post into the page Steve with the pictures for reference...

http://pcbwizards.com/faq.htm

I think the footprint from Protek will work for my board.

Best regards,

Bill Brooks - KG6VVP
PCB Design Engineer , C.I.D.+, C.I.I.
Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
e-mail:[log in to unmask]
http://www.dtwc.com
http://pcbwizards.com


-----Original Message-----
From: Brooks,Bill [mailto:[log in to unmask]]
Sent: Tuesday, November 16, 2004 8:44 AM
To: [log in to unmask]
Subject: Re: [TN] SOD323 problem...

The part we are using is defined on this spec sheet...

http://www.protekdevices.com/datasheets/gblc.pdf


The recommended pads are 0.8mm square and 3.0mm at the extreme dimension
from outside edge to outside edge of the pads. I don't see any reference to
this package in the IPC-SM-782.

What sort of geometries are you dealing with Steve?

Best regards,


Bill Brooks - KG6VVP
PCB Design Engineer , C.I.D.+, C.I.I.
Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
e-mail:[log in to unmask]
http://www.dtwc.com
http://pcbwizards.com


-----Original Message-----
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: Tuesday, November 16, 2004 6:40 AM
To: [log in to unmask]
Subject: Re: [TN] SOD323 problem...

Hi Bill,
The immediate fix is to make the pads larger. The real problem is a larger
CTE mismatch between the SOD323 and the PCB, and thoise leads do not even
deserve to be called leads--zero compliancy. These 'leads' need to be turned
UNDER
the component body to decrease the DNP.
BUT, neither of these steps assures a solution--it may simply move the
failure mode from ripped-out pads to fractured solder attachments.
The real solution is to turn the component upside-down and provide it with
longer compliant leads; no sacrifice in real estate..

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com


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