I am requesting information from the vast knowledge of this forum.  We are going to use a Gennum (QFN 16pin) package with a center thermal ground pad.  I do not have much experience with this package.  

> I was going to suggest to use ENIG or Immersion Silver for the PCB finish due to co-planarity concerns.  
> If I chose to use the board finish I mentioned, should the vias be plated close to prevent solder scavenging during Reflow.
> I am also concerned about the center pad surface tension, causing the part to lift and screw during reflow,  then potentially creating opens on the outer pads.


Any help in this matter would be greatly appreciated, thanks in advance.

Scott.

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