Hi

More points to check:

Body swelling due humidity at the bottom which lift the lead up.
According the photo its may be a small amount volume of solder paste.

Best  Regards

Reuven  ROKAH




                      Werner
                      Engelmaier               To:      [log in to unmask]
                      <[log in to unmask]         cc:
                      COM>                     Subject: Re: [TN] SOD323 problem...
                      Sent by: TechNet
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                      16/11/2004 16:39
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Hi Bill,
The immediate fix is to make the pads larger. The real problem is a larger
CTE mismatch between the SOD323 and the PCB, and thoise leads do not even
deserve to be called leads--zero compliancy. These 'leads' need to be
turned UNDER
the component body to decrease the DNP.
BUT, neither of these steps assures a solution--it may simply move the
failure mode from ripped-out pads to fractured solder attachments.
The real solution is to turn the component upside-down and provide it with
longer compliant leads; no sacrifice in real estate..

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com


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