Use the IPC recommended land patterns...

And come to think of it, Steve said these boards were being hand soldered; I wonder if heat was applied for too long a period of time.  Too much heat will degrade the Cu/laminate bond, and with so little an area it would not take long for damage to occur.  Automated soldering may not cause the same grief, but the land pattern may still be too small (IMHO). 

Disclaimer: YMMV.

Have a good day!

Roger


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Brooks,Bill
Sent: Monday, November 15, 2004 8:40 PM
To: [log in to unmask]
Subject: Re: [TN] SOD323 problem...


Werner... 'you must try to realize.... there is no wall... there is no
wall... there is no wall...'


I'm using a SOD323 in my design... what's the fix?

:)

(p.s. you would have to have seen the movie the 'Matrix' to get that one...)


Bill Brooks - KG6VVP
PCB Design Engineer , C.I.D.+, C.I.I.
Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
e-mail:[log in to unmask]
http://www.dtwc.com
http://pcbwizards.com


-----Original Message-----
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: Monday, November 15, 2004 5:00 PM
To: [log in to unmask]
Subject: Re: [TN] SOD323 problem...

Well, Steve, another example of a throw-it-over-the-wall component from our
friends the component maunfacturers.

Werner

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