Hi Steve! There is a tremendous amount of current industry discussion on
voids in terms of Pbfree soldering, printed wiring board finishes, and
intermetallic phase formation/growth - and as usual several different camps
of thought on the level of solder joint integrity impact. Paul Vianco and
the Sandia Labs crew just published a very good paper which is worth
reading:

P. Vianco, J. Rejent, P. Hlava, "Solid State Intermetallic Compound Layer
Growth Between Copper and 95.5Sn/3.9Ag/.6Cu Solder", Journal of Electronic
Materials, Vo. 33, NO. 9, 2004.

"Champagne voids" doesn't appear to be a "new" phenomena, although the
flooding of Pbfree soldering processes may reintroduce us to the phenomena.

Dave Hillman
Rockwell Collins
[log in to unmask]



Mornin' Werner!

I did a quick search and ran across this:

www.nepcon.co.uk/files/pt_kbryant.pdf

It's a *.pdf of a presentation given by Dage at NEPCON, UK. Scroll down to
the end of the presentation there's a image of champagne voiding. In the
presentation they stated that the exact cause is unknown.

This is the first time I've ever heard of this phenomena...

-Steve Gregory-


Hi 'Netters,
Does anybody have any pictures of the so-called "Champagne-Voids" they can
share. I would very much appreciate it together with some history if
possible.

Thanks,
Werner Engelmaier

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