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November 2004

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Subject:
From:
Lee Parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee Parker <[log in to unmask]>
Date:
Fri, 12 Nov 2004 11:59:39 -0500
Content-Type:
text/plain
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Ted

I imagine your interest in the thickness of OSPs is associated with
their ability to withstand thermal stresses and still provide a
solderable surface.

I am unaware of any definitive studies that showed a strong correlation
between OSP solderability and thickness. Consequently, it appears that
the two are unrelated which initially is contrary to perception.
Probably a better index is the strength of the chemical bond between the
OSP and the base metal (copper).

At the same time, the thicker the coating the more likely it will be
applied after electrical test; it is difficult to penetrate thick OSP
coatings. This is undesirable since most OSP processes involve a micro
etch immediately before applying the OSP that removes copper in the
barrels of the board.

Best regards

Lee

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ted Kong
Sent: Thursday, November 11, 2004 8:14 PM
To: [log in to unmask]
Subject: [TN] OSP standard

Hi fellow Technettes,

Is there a standard on OSP thickness and tolerances?
If anyone is using OSP, please let me know what
thickness and tolerance are being specified.

Thanks all in advance.

Ted Kong

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