TECHNET Archives

November 2004

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
CSP&UBGA manual reballing problems
From:
don_well <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, don_well <[log in to unmask]>
Date:
Thu, 11 Nov 2004 09:30:31 +0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (1 lines) 
Hi guys

    Do you have any experience about CSP&uBGA manual reballing? For example Such as 0.5mm pitch device with 0.3mm balls. 

Any special tools and solder paste is needed?

well don

Huawei Manufacture Center

Experiment Buliding E£­1£­2£­C086

Tel£º0755-89651109

Fax£º0755-89651064

ATOM RSS1 RSS2