Got a question. We are in the process of trying to migrate from a ROM0 solder paste and ROL0 wave flux to a ORM0 solder paste and wave flux. We have build some demonstration boards (with a mixture of BGA, SMT connectors, TQFPs and THT DIPs and PGAs). The boards successfully passed electromigration, Surface and Insulation Resistance and modified ROSE testing. The end product is a Class 3 avionics.

There is some concern about qualification of the tested materials. I am trying to get some feedback on what factors might pose potential soldering performance and reliability concerns.  The test boards replicated the solder mask and board construction technologies that the end product currently uses.

Maybe some one can shed some light on history. I think there was some cases in the early or mid 1980s where there was some reliability problems that occurred in the field with some military hardware. I think they used a water soluble flux with polyproplyene glycols in the HASL operation. Subsequently the boards were assembled and cleaned. But I believe the temperatures of the HASL operation permitted the polypropylene glycols to be absorbed into the laminate and caused leakage currents to occur(?).

Comments?

Tom Gervascio
Senior Process Engineer
Sparton Electronics
(352) 540-4040

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