Hi Steve! Worried about multiple thermal cycles? Absolutely! Most component
fabricators have a policy/guideline/requirment on the number of permissable
thermal cycles which needs to be considered and understood. However, most
component fabricators view any "reballing procedure" as a nonstandard
process so you are on your own anyway in terms of component integrity
issues/concerns. Any reballing procedure/process needs to consider a number
of technology/process interactions: what is the die technology? what is the
component organic set? And how do these material interact with additional
thermal excursions? There can be quite a bit of extra effort to "qualify"
a reballed component reballing process for Class 3 applications. But if you
do your homework the cost/schedule trade-off is a value added effort.

Dave




Hi Dave!

You're not worried about the multiple thermal cycles?

-Steve Gregory-

Hi Steve! Reballed area array components (BGAs, CSPs, FCs) are also
appropriate for Class 3 products provided a strict procedure is followed.
We have created an internal process procedure, using either preforms or
mini-soldersphere placement equipment, to reball components that are
critical in terms of cost or schedule. Issues such as moisture content,
thermal processing impact, ESD,  and solderability need to be addressed in
the procedure but utilizing reballed area array components is achievable
for the Class 3 world too.

Dave Hillman
Rockwell Collins
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