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November 2004

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From:
Joyce Koo <[log in to unmask]>
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Date:
Wed, 10 Nov 2004 10:02:31 -0500
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Agree with Steve.  multiple reflow will "take off" your product life.  I
believe Agere did study regarding device life vs multiple reflow.  The
reliability of those parts are significantly shortened after multiple
reflow.  (not mention if you reflowed at lead free temperature...).  If the
DFR is budgetted one extra reflow in the design, you can either use it at
re-balling or use it at board level, but not both.... (normally, you design
for board 3 reflow, top smt, bottom smt plus one connector...for board...
you can do it for 5 reflow if you like, at "realiability cost"..).  if your
product is one shot deal, like fire arm, who cares... if your product is
lasting 15 years, every bit counts....if it is life support, you better not
have anything "strange" to eat the safety margin....(Since you can not
predict where the device is going to end up, usually it is "no rework")...
                                      jk (my 1.66 cents)

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Steve Gregory
Sent: Wednesday, November 10, 2004 9:20 AM
To: [log in to unmask]
Subject: Re: [TN] Re-balling of BGAs


Hi Dave!

You're not worried about the multiple thermal cycles?

-Steve Gregory-

Hi Steve! Reballed area array components (BGAs, CSPs, FCs) are also
appropriate for Class 3 products provided a strict procedure is followed.
We have created an internal process procedure, using either preforms or
mini-soldersphere placement equipment, to reball components that are
critical in terms of cost or schedule. Issues such as moisture content,
thermal processing impact, ESD,  and solderability need to be addressed in
the procedure but utilizing reballed area array components is achievable
for the Class 3 world too.

Dave Hillman
Rockwell Collins
[log in to unmask]

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