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November 2004

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Subject:
From:
Lee Parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee Parker <[log in to unmask]>
Date:
Wed, 10 Nov 2004 09:46:27 -0500
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Eric

You may want to discuss this with UL. It is my understanding that UL has
some concerns about plated silver that do not apply to immersion silver.
The concern as I understand it is the likelihood of silver migration
which numerous studies have shown does not occur with immersion silver.

Best regards

Lee

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Eric Kalgren
Sent: Wednesday, November 10, 2004 9:31 AM
To: [log in to unmask]
Subject: [TN] Electrodeposited Silver vs. Immersion Silver

Good morning TechNet,



One of our drawings for an RF PCB calls out "Silver Plate per QQ-S-365,
electrodeposited, Type I, 0.0003" thk."  The supplier that we are
getting quotes from says he can't do electrodeposit and wants to supply
immersion silver boards.



Are these two processes equivalent?  I searched the archives and cannot
find any references to ED silver.  Has immersion replaced this process?
(Our drawing is pretty old.)



The board material is Duroid 5880.  would this make a difference?



Thanks for your help!



Eric Kalgren

Manufacturing Engineer

Atlantic Microwave

Phone: 978-779-7062

Fax:     978-779-0101




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