Hi Dave!

You're not worried about the multiple thermal cycles?

-Steve Gregory-

Hi Steve! Reballed area array components (BGAs, CSPs, FCs) are also appropriate for Class 3 products provided a strict procedure is followed.
We have created an internal process procedure, using either preforms or mini-soldersphere placement equipment, to reball components that are critical in terms of cost or schedule. Issues such as moisture content, thermal processing impact, ESD,  and solderability need to be addressed in the procedure but utilizing reballed area array components is achievable
for the Class 3 world too.

Dave Hillman
Rockwell Collins
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