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November 2004

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Subject:
From:
Richard Kraszewski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Richard Kraszewski <[log in to unmask]>
Date:
Wed, 10 Nov 2004 07:09:57 -0500
Content-Type:
text/plain
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text/plain (45 lines)
IPC-J-Std-003, section 4.2.3 explains it rather well.

Rich K / KEDS


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joseph H. Smith
Sent: Wednesday, November 10, 2004 5:01 AM
To: [log in to unmask]
Subject: [TN] solder float test


Hi,

Could anybody explain to me about solder float test.? I would like to
know what 's the criteria for float test? Do we need to inspect the
wetting on surface? or just only in hole?

Thanks & Regards,

SW

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