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November 2004

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Subject:
From:
Paul Edwards <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Paul Edwards <[log in to unmask]>
Date:
Tue, 9 Nov 2004 17:55:05 -0800
Content-Type:
text/plain
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text/plain (60 lines)
Reballing is straight forward and simple once the tooling or fixtures are
purchased and you have some practice with them....

However, the bottom line is whether your customer wants to play "bet your
company on reballed devices" to save money....

Xilinix indicates they have a max of 3 reflow cycles for their parts but
they neither recommend nor guarantee reballed parts...

We don't recommend our customers use reball parts for critical applications.


Paul Edwards
Process Engineering
[log in to unmask]
Tel: 408-433-4700
FAX: 408-433-9988
Surface Art Engineering
81Bonaventura Dr.
San Jose, CA 95134
DUNS: 944740570
CAGE/NCAGE: 1XZ48
-----Original Message-----
From: - Bogert [mailto:[log in to unmask]]
Sent: Tuesday, November 09, 2004 3:24 PM
To: [log in to unmask]
Subject: [TN] Re-balling of BGAs

November 9, 2004

We have an OEM who has some de-laminated PWA'S with some BGA'S installed.
He wants to salvage the parts and have them re-balled.  I have no direct
experience in this area.  How does one re-ball a BGA?  What types of BGA can
be re-balled?  What are the pros and cons on re-balling?  Is this an
acceptable repair method for Class 3 product?
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If not, why not?

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