Happy -

The IPC standard J-003 covers solderability of board finishes.   Dip and
look, rotary dip, rise in through holes, and similar methods are quantified. But
these probably don't tell you what you want to know.  Wetting balance gives
numerical answers that can then be graphed for SPC purposes, for instance, but
the pads on BGAs, dipped or dunked is not the way your customer seems to want to
go.

There have been a number of papers given on solder spread which is not a
quantified IPC method, but is of interest to the "Alternate Final Board Finishes
Committee" of which I am the chairman.

Perhaps the best is to contact you off-line, when I get back from supporting
the IPC at the Embedded Passives conference (pretty successful) in Munich.

Denny Fritz
MacDermid.

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