Hi Steve,
I agree with you 100%
The description of process indicators, as written in the IPC-A610, says
it all. No discussion possible.
(hhmm, then why am I having so much discussion with our inspectors?
hhmm.,...??)
Best regards,
Daan Terstegge
PCB Assembly Department
Thales Land & Joint Systems
Tel +31(0)35 524 8297
Fax +31(0)35 524 8181
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Unclassified Email
>>> [log in to unmask] 11/02/04 02:01am >>>
Hi All!!
I've been getting into a number of debates about "Process Indicators"
as
described in the IPC-610...mostly with our inspectors. I know their
hearts are
in the right place, but it seems that many times they will reject the
assemblies with "Process Indicators" back to our operators to touch
them up, so that
they look more like the "Target Condition", to be more cosmetically
pleasing.
I've tried to explain things as best I can, but find that sometimes
our
operators are touching up way more solder joints than they need
too...they're
being "trained", as it were, by our inspectors. The operators know that
if
something isn't "pretty" enough, it's going to come back to them...so
they're
putting more labor into product than they should.
I'm trying to find some way, any way, to be able to show our inspectors
that
to touch-up something because it doesn't look like the target
condition,
doesn't mean one is making things any better...I understand that beauty
is in
the eye of beholder.
There was some talk in the past about the Intermetallic Layer being
thickened during subsequent reflow cycles, and causing fractures, but
Werner said
that he's never seen a failure because of a thick Intermetallic
layer.
Process Indicators may happen as spelled out in the -610, sometimes not
only
because of the assembly process, but because of the design, or other
factors.
I look at Process Indicators as a "Flag" to investigate whether or not
the
issues can be addressed and resolved properly, if they can't be
resolved, then
it's not a defect. Am I wrong about this?
As always, TIA!
-Steve Gregory-
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