Thankyou
-Al Onderick
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]] On Behalf Of Ingemar
Hernefjord (KC/EMW)
Sent: Monday, November 08, 2004 1:56 AM
To: [log in to unmask]
Subject: Re: [TN] Via hole failures (with pictures)
Al,
I recommend you Puligandla Viswanadham's book about failure trackdown.
Pages and pages about
failures in electronic boards,even about PTH failure modes. International
Thomson Publishing or Chapman&Hall.
ISBN 0-412-10591-8-9000. (I'll send a table of main PTH failure modes to
Steve's Homestead Gallery.
From this book your failure reminds of what the author calls 'barrel
cracks due to thermal stress',
which means that you may have to do with horizontal grain structure
copper, which is brittle and can
crack and deteriorate locally when exposed to wave soldering and other
temp changes.
Just another idea...
Ingemar Hernefjord
Ericsson Microwave Systems
I hope spreading knowhow this way is acceptable and not being against
Iron-Jack's commercialism rules. I'm
presenting a small table from the book, on the other hand I'm advertising
his product at the same tim, which both
maneuvres ought to make sence and balance....
I have a couple of boards that have failed at a customer site. After
testing, a via was identified as open. The following link is a picture of
the cross section.
http://www.tier1gear.com/temp/via_crack.jpg
The board was .062, the via .010 and the surface finish immersion white
tin.
I would appreciate any insight into what may cause a failure like this.
Al Onderick
National Instruments
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