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November 2004

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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 8 Nov 2004 09:03:48 -0500
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Mornin' Inge!

I've got the chart posted. Go to:

http://www.stevezeva.homestead.com

I've also posted the picture of the 2004 Home Computer. MAN! I just got to get me one of those! Question though, does it come with air bags?

-Steve Gregory-


Al,
I recommend you Puligandla Viswanadham's book about failure trackdown. Pages and pages about
failures in electronic boards,even about PTH failure modes. International Thomson Publishing or Chapman&Hall.
ISBN 0-412-10591-8-9000. (I'll send a table of main PTH failure modes to Steve's Homestead Gallery.
From this book your failure reminds of what the author calls 'barrel cracks due to thermal stress',
which means that you may have to do with  horizontal grain structure copper, which is brittle and can
crack and deteriorate locally when exposed to wave soldering and other temp changes.
Just another idea...

Ingemar Hernefjord
Ericsson Microwave Systems

I hope spreading knowhow this way is acceptable and not being against Iron-Jack's commercialism rules. I'm
presenting a small table from the book, on the other hand I'm advertising his product at the same tim, which both
maneuvres ought to make sence and balance....




I have a couple of boards that have failed at a customer site. After
testing, a via was identified as open. The following link is a picture of
the cross section.

http://www.tier1gear.com/temp/via_crack.jpg

The board was .062, the via .010 and the surface finish immersion white
tin.

I would appreciate any insight into what may cause a failure like this.

Al Onderick
National Instruments

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