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November 2004

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Subject:
From:
ChangMyung RYU <[log in to unmask]>
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Date:
Sat, 6 Nov 2004 00:50:33 +0000
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Dear Technetter,

I got the following questions.

For 2 Layered CSP-type Laminate Packages with 100micron via,

what is the maximum electrical current(I) capacity for each via?

To meet all reliability specs, Is it safe to use larger via diameter?

Package Module Specs are below:

1.  power = 1 watt

2.  voltage = 1.8 volt

3.  current = 0.56 A

4.  Frequency = 200 MHz


Any IPC specs. regarding above issues?



Sincerely Yours,

================================================
  Carl Ryu
  Principal Engineer
  Samsung
================================================

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