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November 2004

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 5 Nov 2004 13:47:49 EST
Content-Type:
text/plain
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text/plain (29 lines)
Hi Matthew,
The gold-plating is not your problem; youy need to consider the whole
attachment situation. All the gold does is protect the layer underneath it, which is
most likely nickel. So what yopu are doing is trying to solder to nickel, not
gold. Soldering to nickel takes higher temperatures and more heat than
soldering to copper or soldering to solder. The dissolution rate of Ni into Sn is
about 100-times slower than the dissolution rate of Cu.
Thus, what you are seeing is no   surprise at all.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com


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