I showed the tin whisker nightmare photo's to an RF engineer I know here and
she said that they had similar problems years ago in the Space applications
field and the solved it by coating the surface with 'Q-Dope' a
polystyrene/tolulene
Q-Dope
http://www.takefiveaudio.com/gc_q_dope.htm
Material/Safety specs
http://www.chess.cornell.edu/Safety/MSDS/polystyrene_Q_Dope.htm
TIN Whisker Pictures
http://nepp.nasa.gov/whisker/photos/waveguide/index.html
Maybe the solution to TIN plating issues is some sort of coating or barrier
to prevent whiskers? Could conformal coating stop the whiskers from forming
after assembly?
(Makes you wonder why we are even caving in to the pressure to change from
tin/lead solder....)
Bill Brooks - KG6VVP
PCB Design Engineer , C.I.D.+, C.I.I.
Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510
e-mail:[log in to unmask]http://www.dtwc.comhttp://pcbwizards.com
-------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------