Hmmmmmmmmmmmmm

I do not believe that lead in the pure form is used in any component
termination - I believe the only form it is to be found in is either in
terminations or internal construction is in the form of alloys (otherwise
called solders).

Interesting point is how you define solder. Most of us think of it as the
metal in the joint - but when it is in a paste it is still solder - when it
is bar form it is still solder - and so if you terminate your component with
63/37 et al and it is not joined to anything else, it is still described as
solder. And I believe this is valid PROVIDING that the finish is intended to
be incorporated into a solder joint.

Dictionar definition of solder is: "(s?d´er) , metal alloy used in the
molten state as a metallic binder. The type of solder to be used is
determined by the metals to be united. " 

So I guess the argument here is for a component termination with a
pre-applied solder finish for the purposes of "uniting" the component finish
with the board finish, utilizing the solder in the termination which is
pre-applied along with solder added in the form of paste.

Just a few thoughts,

John

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Tracey Christiansen
Sent: Thursday, November 18, 2004 10:06 AM
To: [log in to unmask]
Subject: [LF] Lead in electrical component finishes


I need help with an interpretation of exemption Number 7 in the ROHS annex
regarding servers.

The exemption reads:
"- lead in solders for servers, storage and storage array systems (exemption
granted until 2010)"

The annex does not just say "lead" -- it says "lead in solders".  Therefore,
there is an opinion that only lead used in solder is considered exempt
(until 2010).  Lead used elsewhere (such as in component finishes) is not
exempt.

I have read a DTI guidance document - July 2004 that suggests that solder is
defined as "alloys used to create metallurgical bonds between two or more
metal surfaces to achieve an electrical or physical connection."  The same
document also states that their interpretation is that the exemption applies
to the whole of the finished device to include components (where
metallurgical bonds are created).  With this in mind, we have now formed a
different opinion that component finishes can fall within the exemption.

Would anyone on this forum like to offer an opinion on which interpretation
is compliant with the exemption?

Thanks for your consideration of my dilemma,

Tracey C


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